Micron will begin meaningfully expanding total advanced packaging capacity at its Singapore HBM facility beginning in early calendar 2027.
Micron Technology · Company
What was said
“The project will expand available cleanroom space and we expect initial output in late calendar 2028, enhancing our advanced memory manufacturing capabilities and supporting future customer demand; •Singapore: We broke ground in January 2025 on an HBM advanced packaging facility to meaningfully expand our total advanced packaging capacity beginning in early calendar 2027.”